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Semiconductor X-ray Inspection--HT100L
Equipment overview
Used for detection of LED chips, LED internal bonding wires, LED crystal wires, IC packages, correction bridges, resistors, capacitor connectors, etc.
Functions and Feature
The X-ray tube moves up and down, the flat-panel detector moves up and down and tilts 45°, the XYAxis of the stage moves back and forth, left and right, And the five-axis motion structure allows defects at anylocation in the product to be easily detected.
Technical specifications
X-ray imaging
Note: The above information only represents general descriptions and characteristics, which may change with technological advancement and equipment upgrades. Specific parameters are subject to the final agreement.
Semiconductor X-ray Inspection--HT100L
Equipment overview
Used for detection of LED chips, LED internal bonding wires, LED crystal wires, IC packages, correction bridges, resistors, capacitor connectors, etc.
Functions and Feature
The X-ray tube moves up and down, the flat-panel detector moves up and down and tilts 45°, the XYAxis of the stage moves back and forth, left and right, And the five-axis motion structure allows defects at anylocation in the product to be easily detected.
Technical specifications
X-ray imaging
Note: The above information only represents general descriptions and characteristics, which may change with technological advancement and equipment upgrades. Specific parameters are subject to the final agreement.
