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X-ray inspection equipment for the electronics industry--HT100
Equipment overview
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.
Functions and Feature
1. Large Size Inspection Table, Laser Locator for Precise Location
2. CNC Programming, Automatic BGA Voids Measurement, Results Can be Exported
3. ±60°Oblique Views Table
4. 5-Axis Movement
5. Adjustable Console
6. Safety Electromagnetic Interlock
Technical specifications
X-ray imaging
Note: The above information only represents general descriptions and characteristics, which may change with technological advancement and equipment upgrades. Specific parameters are subject to the final agreement.
X-ray inspection equipment for the electronics industry--HT100
Equipment overview
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.
Functions and Feature
1. Large Size Inspection Table, Laser Locator for Precise Location
2. CNC Programming, Automatic BGA Voids Measurement, Results Can be Exported
3. ±60°Oblique Views Table
4. 5-Axis Movement
5. Adjustable Console
6. Safety Electromagnetic Interlock
Technical specifications
X-ray imaging
Note: The above information only represents general descriptions and characteristics, which may change with technological advancement and equipment upgrades. Specific parameters are subject to the final agreement.
