Electronic Manufacturing BGA CSP 6-Axis Movement X-ray Inspection Equipment

Electronic manufacturing x-ray inspection equipment--HT300

Equipment overview

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.

Functions and Feature

1. Large Size Inspection Table with 360° rotation Laser Locator for Precise Location

2. Accurate Control, CNC Programming Automatic Positioning

3. FPD 70° Tilting Inspection

4. 6-Axis Movement

5. Adjustable Console

6. Analog 3D Function，HDR image enhancement

Technical specifications

X-ray imaging

Note: The above information only represents general descriptions and characteristics, which may change with technological advancement and equipment upgrades. Specific parameters are subject to the final agreement.